PCB能力
| 项目 | 批量 | 样品 | |
| 层数 | 2~68L | 100L | |
| 最大板厚 | 10mm（394mil） | 14mm（551mil） | |
| 最小线宽间距 | 内层 | 2.2mil/2.2mil | 2.0mil/2.0mil |
| 外层 | 2.5/2.5mil | 2.2/2.2mil | |
| 对位能力 | 同张芯板对位 | ±25um | ±20um |
| 层间对位 | ±5mil | ±4mil | |
| 最大铜厚 | 6Oz | 30Oz | |
| 孔径 | 机械钻孔 | ≥0.15mm(6mil) | ≥0.1mm(4mil) |
| 激光钻孔 | 0.1-0.35mm | 0.075-0.35mm | |
| 最大尺寸 | 单板 | 850mmX570mm | 1000mmX600mm |
| （完成尺寸） | 背板 | 1250mmX570mm | 1320mmX600mm |
| 厚径比 | 单板 | 18:01 | 24:01:00 |
| （完成孔径） | 背板 | 22:01 | 25:01:00 |
| 材料 | 无铅/无卤 | EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF | |
| 高速 | Megtron6, Megtron4, Megtron7,TU872SLK, FR408HR,N4000-13Series,MW4000,MW2000,TU933 | ||
| 高频 | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 | ||
| 其他 | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega , ZBC2000, | ||
| 表面处理 | 喷锡，化学镍金，化学锡，OSP，化学银，金手指，电镀硬金/软金，选择性OSP，化学镍钯金 | ||
| 产品类型 | 参数 | 2017 | 2018 | 2019 | ||||
| 批量 | 样品 | 批量 | 样品 | 批量 | 样品 | |||
| 背板 | 层数 | 68L | 100L | 68L | 100L | 68L | 100L | |
| 完成尺寸 | 1250mmX570mm | 1320mmX570mm | 1250mmX570mm | 1320mmX570mm | 1250mmX570mm | 1320mmX570mm | ||
| 厚度 | 10mm | 14mm | 10mm | 14mm | 10mm | 14mm | ||
| 厚径比(完成孔径) | 22:01 | 25:01:00 | 25:01:00 | 35:01:00 | 25:01:00 | 35:01:00 | ||
| 单板 | 层数 | 36 | 32 | 36 | 36 | 36 | 36 | |
| 外层线宽/间距 | 3mil/3mil | 2.8mil/2.8mil | 3mil/3mil | 2.5mil/2.5mil | 3mil/3mil | 2.5mil/2.5mil | ||
| 内层线宽/间距 | 2.2mil/2.2mil | 2mil/2mil | 2.2mil/2.2mil | 2mil/2mil | 2.2mil/2.2mil | 2mil/2mil | ||
| 厚径比(完成孔径) | 18:01 | 24:01:00 | 20:01 | 28:01:00 | 20:01 | 28:01:00 | ||
| 阻抗公差 | ±8% | ±5% | ±7% | ±5% | ±7% | ±5% | ||
| 厚铜 | 最大铜厚 | 6Oz | 30Oz | 6Oz | 30Oz | 6Oz | 30Oz | |
| HDI | 结构 | Any Layer(10L) | Any Layer(12L) | Any Layer(10L) | Any Layer(14L) | Any Layer(10L) | Any Layer(16L) | |
| 外层线宽/间距 | 2.5/2.5mil | 2.2/2.2mil | 2.2/2.2mil | 2.0/2.0mil | 2.0/2.0mil | 1.6/1.6mil | ||
| 盲孔厚径比 | 1:01 | 1.2:1 | 1:01 | 1.2:1 | 1.2:1 | 1.2:1 | ||
| 射频产品 | 微带线精度 | 线宽 | ±0.8mil | ±0.8mil | ±0.8mil | ±0.5mil | ±0.8mil | ±0.5mil |
| 线长 | ±1.5mil | ±1.5mil | ±1.5mil | ±1.2mil | ±1.2mil | ±1mil | ||
| 金属基 | 结构 | Post-bonding, Pre-bonding, Sweat-soldering, Conductive adhesive, Press-fit,Embedded Coin(I, T U) | ||||||
| 刚挠产品 | 结构 | Book, Air-gap, Fly-tail, Unsymmetrical, Semi-flex | ||||||
| 材料 | Polyimide, Halogen-free, Lead-free, LCP, Tk | |||||||
| 特殊工艺 | POFV(VIPPO)，混压，局部混压，长短/分级/分段金手指，空腔，台阶槽，背钻，侧壁金属化，N+N结构，双面压接机械盲孔，埋入式芯片/分立器件/平面电容电阻，局部厚铜，高温压合，铜浆/银浆塞孔，跳孔 | |||||||
